Index "4"Vendor:LITTELFUSEPackage Cooled:08+D/C:9700
The second step is to load byte address and byte data. During the Byte Program operation, the addresses are latched on the falling edge of either CE# or WE#, whichever occurs last; and the data is latched on the rising edge of either CE# or WE#, whichever occurs first.
Vendor:LITTELFUSEPackage Cooled:08+D/C:9700
The second step is to load byte address and byte data. During the Byte Program operation, the addresses are latched on the falling edge of either CE# or WE#, whichever occurs last; and the data is latched on the rising edge of either CE# or WE#, whichever occurs first.
Vendor:NECPackage Cooled:SOJD/C:01+
Package Cooled:SOP8D/C:04+
The Atmel cell (Figure 4) is simple and small and yet can be programmed to perform all the logic and wiring functions needed to implement any digital circuit. Its four sides are functionally identical, so each cell is completely symmetrical.
Specified Performance High Speed Mode: SCL = 3.4MHz Fast Mode: SCL = 400kHz Standard Mode, SCL = 100kHz High Speed Mode: SCL = 3.4MHz Fast Mode: SCL = 400kHz Standard Mode, SCL = 100kHz High Speed Mode: SCL = 3.4MHz Fast Mode: SCL = 400kHz Standard Mode, SCL = 100kHz SCL Pulled HIGH, SDA Pulled HIGH
Vendor:BOURNSPackage Cooled:99/00D/C:2100
Figure 2 shows a typical test circuit for evaluation of the LM2462. This circuit is designed to allow testing of the LM2462 in a 50Ω environment without the use of an expensive FET probe. The two 2490Ω resistors form a 200:1 divider with the 50Ω resistor and the oscilloscope. A test point is included for easy use of an oscilloscope probe.
Vendor:BOURNSPackage Cooled:dip8PD/C:97+
Liefermöglichkeiten und technische Änderun- gen vorbehalten. Fragen ber Technik, Preise und Liefermögli- chkeiten richten Sie bitte an den Ihnen nächst- gelegenen Vertrieb Halbleiter in Deutschland oder an unsere Landesgesellschaften im Aus- land. Bauelemente können aufgrund technischer Erfordernisse Gefahrstoffe enthalten. Ausknfte darber bitten wir unter Angabe des betre...
Differential Inputs: This input pair is a differential signal input to the device. Input accepts AC- or DC-coupled signals as small as 100mV (200mVPP). Each pin of the pair internally terminates to a VT pin through 50Ω. Note that this input defaults to an indeterminate state if left open. Please refer to the "CLK0 Input Interface Applications" section for more details.
The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may ...
Vendor:BOURNSPackage Cooled:ZIP-10D/C:2000+
The HYM532414C M-Series is a 4Mx32-bit Extended Data Out mode CMOS DRAM module consisting of eight HY5117404C in 24/26 pin SOJ on a 72 pin glass-epoxy printed circuit board. 0.1µF and 0.01µF decoupling capacitors are mounted for each DRAM. The HYM532414CM is Tin plated and HYM532414CMG is Gold plated socket type Single In-line Memory Module suitable for easy interchange and addition of 16M byte m...
The LT®5519 mixer is designed to meet the high linearity requirements of wireless and cable infrastructure trans- mission systems. A high speed, internally 50Ω matched, LO amplifier drives a double-balanced mixer core, allow- ing the use of a low power, single-ended LO source. An RF output transformer is integrated, thus eliminating the need for external matching components at the RF output, while ...
Vendor:BOURNSPackage Cooled:SIP-10D/C:0013/9950
All parameters specified at TA = -40C to +85C unless otherwise noted. These parameters guaranteed by design and characterization. Human Body Model per MIL-STD-883, Method 3015, CDischarge = 100pF, RDischarge = 1.5KΩ, VN grounded. Standard IEC 61000-4-2 with CDischarge = 150pF, RDischarge = 330Ω, VN grounded. These measurements performed with no external capacitor on CHX.
A 75 Ω termination resistor with short traces should be attached between Y and ground for optimum performance. In normal operating modes other than SCART and RGB bypass, this pin outputs the composite video signal. In SCART and RGB Bypass modes, this pin outputs the red signal.
1. Mounted onto a 2 square FR−4 Board (1 sq. 2 oz. Cu 0.06 thick single sided), t < 10 seconds. 2. Mounted onto a 2 square FR−4 Board (1 sq. 2 oz. Cu 0.06 thick single sided), t = steady state. 3. Minimum FR−4 or G−10 PCB, t = steady state. 4. Pulse Test: Pulse Width = 10 ms, Duty Cycle = 2%.
HARDWARE DATA PROTECTION: The Hardware Data Protection feature protects against inadvertent programs to the AT49BV/LV040 in the following ways: (a) VCC sense: if VCC is below 1.8V (typical), the program function is inhib- ited. (b) Program inhibit: holding any one of OE low, CE high or WE high inhibits program cycles. (c) Noise filter: pulses of less than 15 ns (typical) on the WE or CE inputs will not...
Vendor:INFINEONPackage Cooled:TSSOP-20D/C:4
Twin mode: Two groups for KEY1 C 8 direct key or 44 MATRIX keys C Two-page trigger C Key debounce time: 22ms/45ms C Trigger function: Level hold/one shot/level trigger C FLAG1, FLAG2 outputs: 3Hz/sound level/busy/6Hz/endp C Melody/tone decay time: 2 sec/1 sec/0.5 sec/0.25 sec C Four kinds of envelope shapes for melody Tone shape: tone+2kHz/noise/tone/silence Tempo: 16ms/section~1 sec/section Dice f...
Vendor:INFINEONPackage Cooled:TSSOP-20D/C:4
Twin mode: Two groups for KEY1 C 8 direct key or 44 MATRIX keys C Two-page trigger C Key debounce time: 22ms/45ms C Trigger function: Level hold/one shot/level trigger C FLAG1, FLAG2 outputs: 3Hz/sound level/busy/6Hz/endp C Melody/tone decay time: 2 sec/1 sec/0.5 sec/0.25 sec C Four kinds of envelope shapes for melody Tone shape: tone+2kHz/noise/tone/silence Tempo: 16ms/section~1 sec/section Dice f...
Vendor:TELEDYNEPackage Cooled:CAND/C:1235
Vendor:TELEDYNEPackage Cooled:CAND/C:1002
Vendor:INTERSIL
The 43142IV/43142IV drive up to nine white LEDs with constant current and high efficiency to provide LCD backlighting in cell phones, PDAs, and other handheld devices. The series connection allows the LED currents to be identical for uniform brightness and minimizes the number of traces to the LEDs. The 43142IV regulates constant LED current over the entire temperature range. The 43142IV features an ambient...
Vendor:INTERSILPackage Cooled:SOP14D/C:03+
Differential amplifiers are somewhat more difficult to bal- ance. The offset adjustment used for a differential amplifier can degrade the common mode rejection ratio. Figure 5 shows an adjustment circuit which has minimal effect on the common mode rejection. The voltage at the arm of the pot is divided by R4 and R5 to supply an offset correction of 7.5 mV. R4 and R5 are chosen such that the common mo...
Vendor:TELEDYNEPackage Cooled:CAND/C:1023
Vendor:459Package Cooled:MOTOROLA
Vendor:MOLEXD/C:07+
As seen in the block diagram, the module contains a single Light Emitting Diode (LED) as its light source. The light is collimated into a parallel beam by means of a single lens located directly over the LED. Opposite the emitter is the integrated detector circuit.
Vendor:MOLEXD/C:07+
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso- lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operations section of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect device reliability.
Vendor:MOLEXD/C:07+
Notes. 1. Clock on latency is defined from when the clock enable goes active to when the first valid clock comes out of the device. 2. Clock off latency is defined from when the clock enable goes inactive to when the last clock is driven low out of the device. 3. Power up latency is when PD# goes inactive (high) to when the first valid clocks are output by the device. 4. Power down has controlled clock c...
Vendor:TELEDYNEPackage Cooled:CAND/C:1235
Vendor:PANASONIPackage Cooled:DIP4D/C:07/08+
5) Next, a heat sink with lower SA than the one calcu- lated in step 4 must be selected. One way to do this is to simply look at the graphs of the "Heat Sink Temp Rise Above the Ambient" vs. the "Power Dissipation" and select a heat sink that results in lower tempera- ture rise than the one calculated in the previous step. The following heat sinks from AAVID and Thermalloy m...
Vendor:STPackage Cooled:QFN
Vendor:SOP- 8Package Cooled:TID/C:2004+
involves the following phases : PHASE 0: The duration is a time period TS, which incorporates the Power On Reset time period. This time TS is typically 0.2 sec. PHASE 1: The duration is 0.5 second or 3 seconds. This can be defined by the mask option SPH1. During this phase the iron heats. The ASO function is not active. The LED is off. The relay is NC and the control voltage is not applied to its coil ...
Package Cooled:08+D/C:800
The bq2019 provides 64 bytes of general-purpose flash memory, 8 bytes of ID ROM, and 32 bytes of flash-backed RAM for data storage. The nonvolatile memory can maintain formatted battery-monitor information, identification codes, warranty information, or other critical battery parameters when the battery is temporarily shorted or deeply discharged.
Vendor:STPackage Cooled:SOP
The CY7C53120L8/3150L contains a very flexible five-pin communication port that can be configured to interface with a wide variety of media transceivers at a wide range of data rates. The communication port can operate at either 3.3V or 5V. In 5V mode the communication port is completely backward compatible with existing 5V transceivers. The most common transceiver types are twisted-pair, powerline, RF, IR, ...
Vendor:STPackage Cooled:SOP
The CY7C53120L8/3150L contains a very flexible five-pin communication port that can be configured to interface with a wide variety of media transceivers at a wide range of data rates. The communication port can operate at either 3.3V or 5V. In 5V mode the communication port is completely backward compatible with existing 5V transceivers. The most common transceiver types are twisted-pair, powerline, RF, IR, ...
Vendor:NSPackage Cooled:SOP8D/C:03+
Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating the device outside of its operating ratings. The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(Max), the junction-to-ambient thermal resistance, JA, and the ambient temperature, TA.
Vendor:NSPackage Cooled:SOP8D/C:03+
Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating the device outside of its operating ratings. The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(Max), the junction-to-ambient thermal resistance, JA, and the ambient temperature, TA.
Vendor:NSCD/C:01-04+
The regulated voltage output. An output capacitor of 1µF is recommended to minimize any tran- sient load disturbances under normal operating conditions. Additional output capacitance can be used to further improve transient load response.
Vendor:SIPEXPackage Cooled:SMD8D/C:06+
Parameter VDD to GND VA, VB, VW to GND Digital Input Voltage to GND (CS, CLK, U/D) Maximum Current IWB, IWA Pulsed IWB Continuous (RWB 5 kΩ, A open)1 IWA Continuous (RWA 5 kΩ, B open)1 IAB Continuous (RAB = 10 kΩ/50 kΩ/100 kΩ)1 Operating Temperature Range Maximum Junction Temperature (TJmax) Storage Temperature Lead Temperature (Soldering, 10 s C 30 s) Thermal R...
Vendor:NSCPackage Cooled:SMD-8
Input Frequency Output Clock Rise Time Output Clock Fall Time Output Clock Duty Cycle, all MHz clocks PCI Output to Output Skew Skew of EPCI with respect to PCI Cycle to Cycle Jitter, PCI clocks EMI reduction, peaks of 5th - 19th odd harmonics Power up time, PWRDWN# high to all clocks stable Power on time, applied VDD to all clocks stable
Vendor:TELEDYNEPackage Cooled:CAND/C:1235
Vendor:TELEDYNEPackage Cooled:CAND/C:1023
Vendor:TELEDYNEPackage Cooled:CAND/C:1002
Vendor:TELEDYNEPackage Cooled:CAND/C:1235
Vendor:TELEDYNEPackage Cooled:CAND/C:1023
Vendor:TELEDYNEPackage Cooled:CAND/C:1235
Vendor:TELEDYNEPackage Cooled:CAND/C:1002
Vendor:TELEDYNEPackage Cooled:CAND/C:1023
Vendor:MICPackage Cooled:00+D/C:SOP
The IDT70V06 is a high-speed 16K x 8 Dual-Port Static RAM. The IDT70V06 is designed to be used as a stand-alone 128K-bit Dual-Port Static RAM or as a combination MASTER/SLAVE Dual-Port Static RAM for 16-bit-or-more word systems. Using the IDT MASTER/ SLAVE Dual-Port Static RAM approach in 16-bit or wider memory system applications results in full-speed, error-free operation without the need for additional d...
Vendor:N/APackage Cooled:N/AD/C:08+09+
CP: This is the input for the charge pump. For applications requiring a charge pump, connect this pin to the charge pump diode and flying capacitor, as shown in the applications diagram of Figure 4. For applications where no charge pump is required, this pin should be grounded.
Vendor:STPackage Cooled:BGA
The RC2207 is designed to operate over a power supply range of +4V to 13V for split supplies, or 8V to 26V for single supplies. At high supply voltages, the frequency sweep range is reduced. Performance is optimum for 6V, or 12V single supply operation.
Vendor:STPackage Cooled:BGA
The RC2207 is designed to operate over a power supply range of +4V to 13V for split supplies, or 8V to 26V for single supplies. At high supply voltages, the frequency sweep range is reduced. Performance is optimum for 6V, or 12V single supply operation.
Package Cooled:SMD-8D/C:04 05
Vendor:TELEDYNEPackage Cooled:CAND/C:1235
Vendor:INTERSILPackage Cooled:SOP14D/C:00+
Vendor:ZILOGPackage Cooled:SMD18D/C:08+
The DS1258AB provides full functional capability for VCC greater than 4.75V, and write protects by 4.5V. The DS1258Y provides full functional capability for VCC greater than 4.5V and write protects by 4.25V. Data is maintained in the absence of VCC without any additional support circuitry. The NV static RAMs constantly monitor VCC. Should the supply voltage decay, the NV SRAMs automatically write protect thems...
Vendor:MolexD/C:08+
Vendor:TELEDYNEPackage Cooled:CAND/C:1174
Vendor:TELEDYNEPackage Cooled:CAND/C:2036
Vendor:TELEDYNEPackage Cooled:CAND/C:1166
Vendor:TELEDYNEPackage Cooled:CAND/C:1124
Vendor:TELEDYNEPackage Cooled:CAND/C:1149
Vendor:CSPackage Cooled:SOP16
BVDSSDrain-to-Source Breakdown Voltage-100 ∆BV DSS/∆T J Temperature Coefficient of Breakdown Voltage RDS(on)Static Drain-to-Source On-State Resistance VGS(th)Gate Threshold Voltage-2.0 gfsForward Transconductance6.8 IDSSZero Gate Voltage Drain Current