Index "T"Vendor:KEMETPackage Cooled:KEMETD/C:09+
The next four bits of the slave address are the device address. The physical device address is defined by the state of the A0, A2, A3 inputs. The T495X337M010ASE050 compares the serial data stream with the address input state; a successful compare of all four address bits is required for the T495X337M010ASE050 to respond with an acknowledge. The A0, A2, A3 inputs can be actively driven by CMOS i...
Input a signal to the Pin18 and measure the output between the Pins22 and 23 at an output distortion factor of 5%. Input a signal (C45dBm) to the Pin18 and mea- sure an output change between the Pins22 and 23 when IL changes from 80mA to 30mA. Input a signal (C45dBm) to the Pin18 and measure an output change between the Pins 22 and 23 when the Pin12 changes from no microphone input signal to C40dBm...
Vendor:KEMETPackage Cooled:O8+D/C:09+
Vendor:KEMET ELE
Vendor:KEMETPackage Cooled:kemetD/C:07+
FEAST provides a flexible slave interface for easy connectivity with industry-standard buses. The Bus Interface Unit (BIU) can handle synchronous as well as asynchronous buses, with different signals being used for each one. FEAST's bus interface supports synchronous buses like the VESA local bus, as well as burst mode DMA for EISA environments. Asynchronous bus support for ISA is supported even though ISA ...
Vendor:KEMETPackage Cooled:SMDD/C:09+
Output Voltage Range Adjustable From 1.2 V to 37 V Output Current Greater Than 1.5 A Internal Short-Circuit Current Limiting Thermal Overload Protection Output Safe-Area Compensation Package Options Include Plastic Small-Outline Transistor SOT-223 (DCY), Flange Mounted (KTE) and Heat-Sink Mounted (KC) Packages
Vendor:KEMETPackage Cooled:SMDD/C:09+
Output Voltage Range Adjustable From 1.2 V to 37 V Output Current Greater Than 1.5 A Internal Short-Circuit Current Limiting Thermal Overload Protection Output Safe-Area Compensation Package Options Include Plastic Small-Outline Transistor SOT-223 (DCY), Flange Mounted (KTE) and Heat-Sink Mounted (KC) Packages
Vendor:KEMETPackage Cooled:SMDD/C:09+
Vendor:KEMET ELE
Package Cooled:SMDD/C:07+
Start Condition All commands to the T495X476K020AS are preceded by the start condition, which is a HIGH to LOW transition of SDA while SCL is HIGH (tHIGH). The T495X476K020AS continuously monitors the SDA and SCL lines for the start condition and will not respond to any command until this condition is met.
Package Cooled:SMDD/C:07+
Start Condition All commands to the T495X476K020AS are preceded by the start condition, which is a HIGH to LOW transition of SDA while SCL is HIGH (tHIGH). The T495X476K020AS continuously monitors the SDA and SCL lines for the start condition and will not respond to any command until this condition is met.
Vendor:KEMETD/C:09+
Vendor:KEMETPackage Cooled:SMDD/C:09+
The output stage of the MD1811 has separate power connections enabling the output signal L and H levels to be chosen independently from the supply voltages used for the majority of the circuit. As an example, the input logic levels may be 0 and 1.8 volts, the control logic may be powered by +5 and C5 volts, and the output L and H levels may be varied anywhere over the range of C5 to +5 volts. The output stage ...
Vendor:KEMETPackage Cooled:SMDD/C:09+
The output stage of the MD1811 has separate power connections enabling the output signal L and H levels to be chosen independently from the supply voltages used for the majority of the circuit. As an example, the input logic levels may be 0 and 1.8 volts, the control logic may be powered by +5 and C5 volts, and the output L and H levels may be varied anywhere over the range of C5 to +5 volts. The output stage ...
Vendor:KEMETPackage Cooled:N/AD/C:08+
Vendor:KEMETPackage Cooled:SMDD/C:08+
The gel die coat and durable polymer package provide a media resistant barrier that allows the sensor to operate reliably in high humidity conditions as well as environments containing common automotive media. Contact the factory for more information regarding media compatibility in your specific application.
Vendor:KEMETPackage Cooled:N/AD/C:08+
The gel die coat and durable polymer package provide a media resistant barrier that allows the sensor to operate reliably in high humidity conditions as well as environments containing common automotive media. Contact the factory for more information regarding media compatibility in your specific application.
Vendor:KEMETPackage Cooled:KEMETD/C:09+
The DDX-2100 Power Device is a dual channel H-Bridge that can deliver over 50 watts per channel of audio output power. The DDX-2100 includes; a logic interface, integrated bridge drivers, high efficiency MOSFET outputs and protection circuitry. Two logic level signals per channel are used to control high-speed MOSFET switches to connect the speaker load to the input supply or to ground in a bridge configur...
Vendor:KEMETPackage Cooled:SMDD/C:09+
NOTES: 1. These power consumption characteristics are for all the valid input interfaces and cover the worst case input and output interface combinations. 2. The termination resistors are excluded from these measurements. 3. If the differential input interface is used, the true input is held LOW and the complementary input is held HIGH.
Vendor:KEMETPackage Cooled:KEMETD/C:09+
Vendor:KEMETPackage Cooled:SMDD/C:09+
Discription Data bit 0 of Transmit Symbol, true data Data bit 1 of Transmit Symbol, true data Data bit 2 of Transmit Symbol, true data Data bit 3 of Transmit Symbol, true data Data bit 4 of Transmit Symbol, true data Data bit 5 of Transmit Symbol, true data Data bit 6 of Transmit Symbol, true data Data bit 7 of Transmit Symbol, true data Data bit 8 of Transmit Symbol, true data Data bit 9 of Tra...
Vendor:KEMETPackage Cooled:SMDD/C:09+
Discription Data bit 0 of Transmit Symbol, true data Data bit 1 of Transmit Symbol, true data Data bit 2 of Transmit Symbol, true data Data bit 3 of Transmit Symbol, true data Data bit 4 of Transmit Symbol, true data Data bit 5 of Transmit Symbol, true data Data bit 6 of Transmit Symbol, true data Data bit 7 of Transmit Symbol, true data Data bit 8 of Transmit Symbol, true data Data bit 9 of Tra...
Vendor:KEMETD/C:08+
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate...
Vendor:KEMETPackage Cooled:KEMETD/C:09+
BiFET operational amplifiers offer the inherently higher input impedance of the JFET-input transistors, without sacrificing the output drive associated with bipolar amplifiers. This makes them better suited for interfacing with high-impedance sensors or very low-level ac signals. They also feature inherently better ac response than bipolar or CMOS devices having comparable power consumption.
Vendor:KEMETPackage Cooled:SMDD/C:09+
Vendor:KEMET ELE
Vendor:KEMETPackage Cooled:KEMETD/C:09+
Vendor:KEMETPackage Cooled:O8+D/C:09+
Vendor:KEMET ELE
Vendor:KEMETPackage Cooled:SMDD/C:06+
Vendor:KEMETPackage Cooled:KEMETD/C:09+
Vendor:KEMETPackage Cooled:SMDD/C:09+
Vendor:140000Package Cooled:SMDD/C:09+
Vendor:KEMETPackage Cooled:kemetD/C:08+
The ISL83699 consists of four SPDT switches. It is configured as a dual double-pole/double-throw (DPDT) device with two logic control inputs that control two SPDT switches each. The configuration can be used as a dual differential 2-to-1 multiplexer/demultiplexer. The ISL83699 is pin compatible with the STG3699.
Vendor:KEMETPackage Cooled:N/AD/C:08+
The ISL83699 consists of four SPDT switches. It is configured as a dual double-pole/double-throw (DPDT) device with two logic control inputs that control two SPDT switches each. The configuration can be used as a dual differential 2-to-1 multiplexer/demultiplexer. The ISL83699 is pin compatible with the STG3699.
Package Cooled:SMDD/C:07+
Composite type with a P-Channel Sillicon MOSFET (MCH3339) and a Schottky Barrier Diode (SBS007M) contained in one package facilitating high-density mounting. [MOSFET] • Low ON-resistance. • Ultrahigh-speed switching. [SBD] • Short reverse recovery time. • Low forward voltage.
Vendor:KEMET ELE
Vendor:KEMETPackage Cooled:SMDD/C:09+
Vendor:KEMETPackage Cooled:N/AD/C:08+
Vendor:KEMETPackage Cooled:SMDD/C:06+
SW(Pin 9): This is the drain of the internal NMOS power switch. Minimize the metal trace area connected to this pin to minimize EMI. VIN(Pin 10): Input Supply Pin. Bypass this pin with a capaci- tor as close to the device as possible. The capacitor should connect between VIN and PGND. SWI(Pin 11): PMOS switch input. Source connection of PMOS device. SWO(Pin 12): PMOS switch output. Drain connection of ...
Vendor:KEMETPackage Cooled:SMDD/C:09+
Vendor:KEMETPackage Cooled:N/AD/C:08+
The DS1543 is available in two packages (28-pin DIP and 34-pin PowerCap module). The 28-pin DIP style module integrates the crystal, lithium energy source, and silicon all in one package. The 34-pin PowerCap module board is designed with contacts for connection to a separate PowerCap (DS9034PCX) that contains the crystal and battery. This design allows the Power-Cap to be mounted on top of the DS1543P a...
Vendor:KEMETPackage Cooled:KEMETD/C:09+
The procedures for the thermal design of the SI-7300A are as follows: (1) As shown in the right figure, the supply current ICC1 and the output current lo are measured at the maximum level of the supply voltage VCC1. However, the motor is in holding mode at the 2-phase excitation. (2) From the above measurements, the internal power dis- sipation (2 phases) of the hybrid IC can be obtained through...
Vendor:KEMETPackage Cooled:O8+D/C:09+
Vendor:KEMETPackage Cooled:SMDD/C:09+
Vendor:KEMETPackage Cooled:SMDD/C:08+
rising edge of the CLK pin. On the falling edge of the 8th clock the data in the serial shift register is latched into the parallel DAR register. The DAR remains powered up when- ever VDD is present. The serial data is clocked into the DATA pin starting with the MSB first. This sequence of threshold select bits is shown in Table 2.
Vendor:KEMETPackage Cooled:O8+D/C:KEMET
Vendor:KEMETPackage Cooled:O8+D/C:09+
Package Cooled:SMDD/C:07+
Keep the output leads as short as possible. In the video frequency range, even a few inches of wire have significant inductance, raising the interconnection impedance and limit- ing the output current slew rate. Furthermore, the skin effect increases the resistance of heavy wires at high frequencies. Multistrand Litz Wire is recommended to carry large video currents with low losses.
Vendor:KEMETPackage Cooled:SMDD/C:09+
NOTES 1Measured at IOUTA, driving a virtual ground. 2Nominal full-scale current, I OUTFS, is 32 times the IREF current. 3An external buffer amplifier with input bias current <100 nA should be used to drive any external load. 4Measured at fCLOCK = 25 MSPS and fOUT = 1.0 MHz. 5Measured at fCLOCK = 100 MSPS and f OUT = 1 MHz. 6Measured as unbuffered voltage output with I OUTFS = 20 mA and 50 Ω R...
Vendor:KEMETPackage Cooled:KEMETD/C:09+
NOTES 1Measured at IOUTA, driving a virtual ground. 2Nominal full-scale current, I OUTFS, is 32 times the IREF current. 3An external buffer amplifier with input bias current <100 nA should be used to drive any external load. 4Measured at fCLOCK = 25 MSPS and fOUT = 1.0 MHz. 5Measured at fCLOCK = 100 MSPS and f OUT = 1 MHz. 6Measured as unbuffered voltage output with I OUTFS = 20 mA and 50 Ω R...
Package Cooled:SMDD/C:07+
Case: Molded Epoxy Epoxy Meets UL94, VO at 1/8 Weight: 70 mg (approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds Polarity: Polarity Band Indicates Cathode Lead ESD Ratings: Machine Model = C ESD Ratings: Human Body Model = 3B Available in 12 mm Tape, 5000 Units...
Vendor:KEMETPackage Cooled:SMDD/C:09+
(4) The products described in this material are intended to be used for standard applications or general elec- tronic equipment (such as office equipment, communications equipment, measuring instruments and house- hold appliances). Consult our sales staff in advance for information on the following applications: Special applications (such as for airplanes, aerospace, automobiles, traffic control ...
Vendor:KEMETPackage Cooled:SMDD/C:09+
Vendor:KEMETPackage Cooled:SMDD/C:09+
The 16 uniform sections available form an 8-step dim- mer via 3-bit binary code. The 8-step dimmer includes 1/16, 2/16, 4/16, 10/16, 11/16, 12/16, 13/16 and 14/16. The 1/16 pulse width indicates minimum lightness. The 14/16 pulse width represents maximum lightness (Refer to the display control command).
Vendor:KEMETPackage Cooled:SMDD/C:09+
Package Cooled:kemetD/C:07+
The GS82032A is a 2,097,152-bit high performance synchronous SRAM with a 2-bit burst address counter. Although of a type originally developed for Level 2 Cache applications supporting high performance CPUs, the device now finds application in synchronous SRAM applications, ranging from DSP main store to networking chip set support.
Vendor:KEMETD/C:O9+
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For enhanced performance, the VRE3041 has an external trim option for users who want less than 0.01% initial error.For ultra low noise applications, an external capacitor can be attached between the noise reduction pin and the ground pin.
Package Cooled:SMDD/C:07+
The 3.3-V 3% regulated output is capable of driving loads of 1.5 A, and the 1.5-V 2% regulated output is capable of driving loads of 300 mA under all normal operating conditions. The device is available in a PowerPAD thermally-enhanced package for efficient heat management, and requires a copper plane to dissipate the heat.
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The ISL6522 provides complete control and protection for a DC-DC converter optimized for high-performance microprocessor applications. It is designed to drive two N-Channel MOSFETs in a synchronous rectified buck topology. The ISL6522 integrates all of the control, output adjustment, monitoring and protection functions into a single package.
Vendor:KEMET ELE
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Reduced Power Consumption C 1.8 V Core Operation With 3.3 V I/Os and Supplies2 Reduced Ground Bounce Using Time Staggered Pixel Outputs Lowest Noise and Best Power Dissipation Using TI PowerPAD Packaging Advanced Technology Using TI 0.18-µm EPIC-5 CMOS Process TFP401A Incorporates HSYNC Jitter Immunity3
Vendor:KEMETPackage Cooled:smdD/C:08+
After a minimum wait of 250 ns (5V operation) from the falling edge of CS (tCS), if CS is brought HIGH, DOUT will indicate the READY/BUSY status of the chip: logical 0 means programming is still in progress; logical 1 means the selected register has been written, and the part is ready for another instruction (see Figure 5). (NOTE: The combination of CS HIGH, DIN HIGH and the rising edge of the SK cloc...
Vendor:KEMETPackage Cooled:SMDD/C:06+
The ISL6310 is a two-phase PWM control IC with integrated MOSFET drivers. It provides a precision voltage regulation system for multiple applications including, but not limited to, high current low voltage point-of-load converters, embedded applications and other general purpose low voltage medium to high current applications. The integration of power MOSFET drivers into the controller IC marks a departure f...
Synchronizer and Baud Rate Selection Linear Receive Strength Signal Indicator (RSSI) Flexible 3-Wire Serial Interface Minimal Number of External Components Required 48-Pin Low-Profile Plastic Quad Flat Package (PQFP) Programmable XTAL Trimming Lock Detect Indicator Programmable Training Sequence Recognition Pin Compatible to the TRF6901
Vendor:KEMETPackage Cooled:SMDD/C:06+
SOIC Package (Note 1) . . . . . . . . . . . .67N/A QFN Package (Note 2). . . . . . . . . . . . .355 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) For Recommended soldering conditions see Tech Brief TB389.
The switch is turned on by a single enable (ON) input. When ON is LOW, the switch is on and port A is connnected to port B. When ON is HIGH, the switch between port A and port B is open and the B port is precharged to BIASV through the equivalent of a 10-kΩ resistor.
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These chips, when properly assembled, display characteristics similar to the TLC372C. Thermal compression or ultrasonic bonding can be used on the doped-aluminum bonding pads. Chips can be mounted with conductive epoxy or a gold-silicon preform.
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These chips, when properly assembled, display characteristics similar to the TLC372C. Thermal compression or ultrasonic bonding can be used on the doped-aluminum bonding pads. Chips can be mounted with conductive epoxy or a gold-silicon preform.
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BVDSSDrain-to-Source Breakdown Voltage-100 ∆BV DSS/∆T J Temperature Coefficient of Breakdown Voltage RDS(on)Static Drain-to-Source On-State Resistance VGS(th)Gate Threshold Voltage-2.0 gfsForward Transconductance6.8 IDSSZero Gate Voltage Drain Current
Vendor:KEMETPackage Cooled:SMDD/C:06+
BVDSSDrain-to-Source Breakdown Voltage-100 ∆BV DSS/∆T J Temperature Coefficient of Breakdown Voltage RDS(on)Static Drain-to-Source On-State Resistance VGS(th)Gate Threshold Voltage-2.0 gfsForward Transconductance6.8 IDSSZero Gate Voltage Drain Current
Vendor:KEMETD/C:O9+
Package Cooled:SMDD/C:07+
Single supply: 2.2 to 3.6 V Access time: 150 ns (max) Power dissipation Active: 10 mW/MHz (typ) Standby: 36 µW (max) On-chip latches: address, data, CE, OE, WE Automatic byte write: 15 ms (max) Automatic page write (64 bytes): 15 ms (max) Ready/Busy Data polling and Toggle bit Data protection circuit on power on/off ...
Package Cooled:smdD/C:07+
Single supply: 2.2 to 3.6 V Access time: 150 ns (max) Power dissipation Active: 10 mW/MHz (typ) Standby: 36 µW (max) On-chip latches: address, data, CE, OE, WE Automatic byte write: 15 ms (max) Automatic page write (64 bytes): 15 ms (max) Ready/Busy Data polling and Toggle bit Data protection circuit on power on/off ...
Vendor:KEMETD/C:O9+
Vendor:KEMETPackage Cooled:SMDD/C:06+
During discharge and charge, the bq2050H monitors V SR for various thresholds used to compensate the charge counter. EDV monitoring is disabled if the dis- charge rate is greater than 2C (OVLD Flag = 1) and re- sumes 1 2 second after the rate falls below 2C.
Vendor:KEMETPackage Cooled:SMDD/C:06+
During discharge and charge, the bq2050H monitors V SR for various thresholds used to compensate the charge counter. EDV monitoring is disabled if the dis- charge rate is greater than 2C (OVLD Flag = 1) and re- sumes 1 2 second after the rate falls below 2C.
Note: 1. These are the frequencies that are selectable after power up using the SEL1 and SEL0 hardware pins. Other frequencies may be chosen using the devices SMBUS interface. See the expanded frequency for a complete listing of all of the availible frequencies. 2. Will be set to 133MHz, when SMBUS Byte3, Bit 0 is set to logic 1.
Vendor:KEMETPackage Cooled:SMDD/C:06+
Parameter LOGIC OUTPUTS (BUSY, SDO)3 VOL, Output Low Voltage VOH, Output High Voltage VOL, Output Low Voltage VOH, Output High Voltage High Impedance Leakage Current High Impedance Output Capacitance LOGIC OUTPUT (SDA)3 VOL, Output Low Voltage
Note: 1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
Vendor:KEMETPackage Cooled:SMDD/C:06+
provided by an active LOW chip enable (CE1), an active HIGH chip enable (CE2), and active LOW output enable (OE) and three-state drivers. This device has an automatic power-down feature (CE1 or CE2), reducing the power consumption by 70% when deselected. The CY7C185 is in a standard 300-mil-wide DIP, SOJ, or SOIC package.
The 50% point of sync is determined by using two identical resistors to divide the voltage between sync tip and back porch. The importance of precision sync tip clamping may be appreciated here, since the sync tip voltage is used in deriving the 50% slicing level. The back porch voltage is derived through an internal integrate and hold circuit that is gated by the Back Porch output signal. By integrating over...
Note : Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to recommended operating condition. Exposure to higher than recommended voltage for extended periods of time could affect device reliability.